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LSI Logic Launches Direct Rambus ASIC Cell
Milpitas, California, March 29, 1999 - LSI Logic, The System on a Chip Companyâ , announced today that it has shipped CoreWare® models for the
Direct Rambus ASIC Cell (D-RAC) in the LSI Logic G11ä
process technology (0.18-micron Leff) to customers. In addition, LSI Logics D-RAC
test chip is functional at the full 800 MHz speed.
Consistent with LSI Logics methodology for CoreWare developments, the D-RAC core
undergoes a thorough process of silicon verification and qualification. LSI Logics
solution supports the Direct Rambus specification and is a key addition to LSI Logics
portfolio of industry-leading high-speed I/Os which includes the GigaBlaze® and HyperPHY
cores. The D-RAC addition to the CoreWare library reinforces LSI Logics leadership
in high-speed I/O and the companys long running expertise in Rambus design
"In a market where development time is critical, we needed a semiconductor partner
with a proven methodology and a track record of successful applications/core
integration," said Lisa Brown, research and development project manager for HP's
ProCurve Networking division, "With LSI Logics D-RAC, we have the benefit of
comprehensive support and LSI Logics experience in high-speed I/O combined with a
high-performance solution that is easy to integrate."
With signal pin rates of up to 800 megabits per second, Direct Rambus technology uses a
two byte wide data path to achieve peak data rates of 1.6 gigabytes per second and is one
of the highest performance memory interfaces available. Combining high bandwidth and
extremely low pin-count, the D-RAC addresses the high-speed memory requirements for a
range of applications from consumer electronics to high-performance computer desktop
systems. By integrating multiple D-RACS onto a single ASIC, customers can reduce pin count
and lower cost.
"Major players in multiple market segments are adopting Rambus technology, and we
expect widespread usage in the near future," said Marc Miller, product marketing
director, LSI Logic. "We have been working with Rambus technology for four years and
are offering a comprehensive set of tools and support for our D-RAC core. Combining this
D-RAC interface with other cores from our CoreWare library enables our customers to reach
the marketplace with leading-edge products and reduced time to market."
"As a recognized ASIC leader in high-performance I/O, LSI Logic is a key Rambus
partner as we move towards widespread adoption of Direct Rambus technology," said
Subodh Toprani, vice president and general manager of Rambus Logic Products
Division. "Weve had a close working relationship with LSI Logic and are
impressed by their strong commitment to Rambus technology to ensure customer success in
implementing the technology."
LSI Logic, a licensee of Rambus technology, is currently working with leading companies
that are integrating the D-RAC cores in their ASICs for different market segments. These
applications span from computer chipsets to network switches, to printers. The D-RAC core
is LSI Logics third generation of Rambus technology, having first offered Concurrent
RACs several years ago in its 0.5-micron process technology. For integration of the D-RAC
core into an ASIC, the CoreWare deliverables include a behavioral model, synthesis and
timing models and a system verification environment. Looking forward, LSI Logic is working
to continue to meet its customers memory interface needs by offering Rambus
technology in future generation CMOS process technologies.
Coupled with LSI Logics existing high-speed I/O capability, the D-RAC core
enables ASICs with very high bandwidth ports to utilize Rambus technologys
high-performance memory interface. For example, ASIC designers may combine LSI Logics
GigaBlaze Cores for standards compliant multi-gigabit serial interconnects or HyperPHY
Cores for multi-gigabyte backplane interconnects with the D-RAC core for a
high-performance memory interface. In addition, LSI Logic offers a full line of buffers
including CPU front-side bus, AGP and PCI buffers to meet system requirements.
About Rambus Inc
Rambus Inc. (NASDAQ: RMBS) develops and markets high-speed chip-to-chip interface
technology that enables semiconductor memory devices to keep up pace with faster
generations of processors and controllers. Currently over 60 companies are committed to
delivering Rambus technology within their products; including 15 DRAM manufacturers
(supplying more than 96% of the worldwide DRAM market); 20 logic IC suppliers and 40
companies representing the leaders in system-memory implementation products (including
memory modules, connectors, clock chips and test systems). More information on Rambus Inc.
and its high bandwidth interface technology is available at http://www.rambus.com.
About LSI Logic
LSI Logic (NYSE:LSI), The System on a Chip Companyâ , is a
leading supplier of custom high-performance semiconductors, with operations worldwide. The
company enables customers to build complete systems on a single chip with its CoreWareâ design program, which increases performance, lowers system costs
and accelerates time to market. LSI Logic develops application-optimized products in
partnership with trendsetting customers, and operates leading-edge manufacturing
facilities to produce submicron geometry chips. The company maintains a high level of
quality as demonstrated by its ISO 9000 certifications. LSI Logic Corporation is
headquartered at 1551 McCarthy Boulevard, Milpitas, California 95035,